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MIX SURFACE MOUNT AND LEADED PARTS ON BREADBOARDS

WHY NOT GET THE BEST OF BOTH WORLDS

In real world prototype, test, and circuit development, as well as when building circuit upgrades or modifications, the need arises to be able to use both the Surface mount and conventional leaded component technologies. Several Surfboard models for I.C.s, discrete devices, and application specific adapters feature Single-In-Line (SIP) pins on .100 in. centers. This means your assemblies are compatible with both conventional and solderless breadboards as well as sockets.

Mixing surface mount and leaded technologies on same breadboard          Surfboard and Uni-Sip breadboards used in tandem

The assembly (above right) shows a Surfboard Sub-assembly plugged into a socket strip mounted on a UNI-SIP (through-Hole) breadboard module, which in turn features SIP pins for plug-in convenience. Uni-Sip boards can serve as mini-mother boards for Surfboard assemblies

Mixed component types on Surfboard          Surfboard SMD breadboard with leaded components added

Surfboards can also be modified by drilling holes to accept leaded devices where needed. A wide range of hybridization's are possible with simple modifications. The example circuits aqbove show larger leaded devices mounted topside, while the Surface Mount devices are on the bottom.

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